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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
C03E.pdf
May.17,2013
! Caution
Continued from the preceding page.
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
[Standard Conditions for Reflow Soldering]
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface ( Δ T) as small as possible.
Temperature (°C)
Peak Temperature
220°C (200°C)
190°C (170°C)
170°C (150°C)
150°C (130°C)
Reflow
Δ T
Preheating
Soldering
Gradual
Cooling
2. Solder ability of tin plating termination chips might be
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of tin is used. Please confirm the solder ability of tin
Temperature
60-120 seconds 30-60 seconds
Time
plated termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference ( Δ T)
between the component and the solvent within the range
Incase of Lead Free Solder
( ): In case of Pb-Sn Solder
Vapor Reflow
Temperature (°C)
shown in table 1.
Peak Temperature
Soldering
Gradual
Cooling
Table 1
Δ T
Part Number
Temperature Differential
190°C (170°C)
170°C (150°C)
GC3/GCD/GCE/GCJ/GCM Series
03/15/18/21/31 sizes
GCJ/GCM Series 32/43/55 sizes
KC3/KCM Series 55 size
Δ T V 190°C
Δ T V 130°C
150°C (130°C)
Preheating
60-120 seconds
Time
20 seconds max.
Recommended Conditions
Pb-Sn Solder
Lead Free
[Allowable Reflow Soldering Temperature and Time]
Reflow
Vapor Reflow
Solder
280
Peak Temperature
Atmosphere
230 to 250°C
Air
230 to 240°C
Saturated vapor
of inactive solvent
240 to 260°C
Air or N 2
270
260
250
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
240
230
220
0
30
60
90 120
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
0.2mm ? min.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
? GRM03: 1/3 of Chip Thickness min.
in section
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to
the end surface to a height of 0.2mm* min.
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
Continued on the following page.
51
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